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mercoledì 20 febbraio 2019
Metal Lift Off - Leonardo LO Series
Photopolymer Film Lamination
Leonardo 200DF
Leonardo 300DF
DIE Attach Film Lamination
Leonardo 200 LD
Metal Lift Off
Leonardo LO Series
BG & Temporary Bonding Film Lamination
Leonardo 200BG
Leonardo 300BG
UV Curing Systems
MWE 200 Plus 6"- 8"
MWE 300 8"- 12"
Wafer Handling & Inspection Systems
MWD 4 "- 6 "
Mini Environment EFEM System
Multiaxis Robots
LP100
Adept Vicron 300 Repair Center
Custom Products
Leonardo 200 L0.pdf
System appearance and specifications are subject to change without prior notice
Features
New method to lift off metal with adhesive tape from wafer
Remove in only one process step metal sandwich such as Ti-Au-Ti or Au-Ti etc
Microcontrol Electronic offers Leonardo 200 Lift Off System on the market giving the following benefits:
- This method allows the customer to choose solvent free process
- Even using solvent, there won’t be the need to destroy metal layer to reach photoresist
- Easier and more environmental friendly method to recycle precious metal waste
WAFER SIZE
150 – 200 mm
THROUGHPUT
Process linked - Average 40 wfrs/h
CENTERING / ALIGNMENT
CONTACLESS / OPTICAL SYSTEM
TAPE COMPATIBILITY
Microcontrol
DLOxxxMA
(xxx = tape width)
FOOT PRINT
1 m
²
CE marking
Full compliance
SEMI Standard
Full compliance
SECS-GEM
Full compliance
WAFER ID / CASSETTE ID
Option OCR - DOT matrix - BCR
Realizzato da: EffemmedueSrl
