Friday, November 24, 2017
Metal Lift Off - Leonardo LO Series



Leonardo 200 L0.pdf


System appearance and specifications are subject to change without prior notice


Features
New method to lift off metal with adhesive tape from wafer
Remove in only one process step metal sandwich such as Ti-Au-Ti or Au-Ti etc
Microcontrol Electronic offers Leonardo 200 Lift Off System on the market giving the following benefits:
- This method allows the customer to choose solvent free process
- Even using solvent, there won’t be the need to destroy metal layer to reach photoresist
- Easier and more environmental friendly method to recycle precious metal waste

WAFER SIZE 150 – 200 mm
THROUGHPUT Process linked - Average 40 wfrs/h
CENTERING / ALIGNMENT CONTACLESS / OPTICAL SYSTEM
TAPE COMPATIBILITY Microcontrol DLOxxxMA
(xxx = tape width)
FOOT PRINT 1 m²
CE marking Full compliance
SEMI Standard Full compliance
SECS-GEM Full compliance
WAFER ID / CASSETTE ID Option OCR - DOT matrix - BCR
Realizzato da: EffemmedueSrl