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Features |
New method to lift off metal with adhesive tape from wafer
Remove in only one process step metal sandwich such as Ti-Au-Ti or Au-Ti etc
Microcontrol Electronic offers Leonardo 200 Lift Off System on the market giving the following benefits:
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This method allows the customer to choose solvent free process
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Even using solvent, there won’t be the need to destroy metal layer to reach photoresist
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Easier and more environmental friendly method to recycle precious metal waste
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| WAFER SIZE |
150 – 200 mm |
| THROUGHPUT |
Process linked - Average 40 wfrs/h |
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CENTERING / ALIGNMENT |
CONTACLESS / OPTICAL SYSTEM
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| TAPE COMPATIBILITY |
Microcontrol DLOxxxMA
(xxx = tape width) |
| FOOT PRINT |
1 m²
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CE marking |
Full compliance |
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SEMI Standard |
Full compliance |
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SECS-GEM |
Full compliance |
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WAFER ID / CASSETTE ID |
Option OCR - DOT matrix - BCR |
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