Thursday, September 21, 2017
Leonardo 200BG

  Leonardo 200BG

  
   Loading Station

             
  Detaping Station

 

       UV Station



Lowest cost of ownership through “total gap control”
software fully adjustable gap between wafers
=
lowest tape consumption

Ultra thin wafers processing: our special zero force lamination technology eliminates extra bow due to tape tension on wafers
Our unique taping roller allows to perfectly process very high bumped wafers
Ultra thin wafer detaping with our special chuck
Fully adjustable software and mechanical detaping process


LEONARDO 200BG TAPER
SYSTEM SPECIFICATIONS
WAFER SIZE Up to 8”
THROUGHPUT Process linked - average 55 wfrs/hr
CENTERING / ALIGNMENT CONTACLESS / OPTICAL SYSTEM
TAPE COMPATIBILITY ALL KIND OF TAPES
MINIMUM TAPE WIDTH 6” 165mm
8” 215mm
FOOT PRINT 1m2
CE marking Full compliance
SEMI Standard Full compliance
SECS-GEM Full compliance
WAFER ID / CASSETTE ID Option OCR - DOT matrix - BCR


LEONARDO 200BG DETAPER
SYSTEM SPECIFICATIONS
WAFER SIZE Up to 8”
THROUGHPUT Process linked - average 65 wfrs/hr
CENTERING / ALIGNMENT CONTACTLESS / OPTICAL SYSTEM
TAPE COMPATIBILITY ALL KIND OF TAPES
FOOT PRINT 1m2
CE marking Full compliance
SEMI Standard Full compliance
SECS-GEM Full compliance
WAFER ID / CASSETTE ID Option OCR - DOT matrix - BCR
UV Station Option


System appearance and specifications are subject to change
without prior notice
Realizzato da: EffemmedueSrl