Friday, November 24, 2017
Leonardo 300BG


   Leonardo 300BG

               
Taping Station

                     
Detaping Station

Robot with Carbon Fiber Handler


Lowest cost of ownership through “total gap control”
software fully adjustable gap between wafers
=
lowest tape consumption

Ultra thin wafers processing: our special zero force lamination technology eliminates extra bow due to tape tension on wafers
Our unique taping roller allows to perfectly process very high bumped wafers
Ultra thin wafer detaping with our special chuck
Fully adjustable software and mechanical detaping process


LEONARDO 300BG TAPER
SYSTEM SPECIFICATIONS
WAFER SIZE 8” - 12"
THROUGHPUT Process linked - average 50 wfrs/hr
CENTERING / ALIGNMENT CONTACTLESS / OPTICAL SYSTEM
TAPE COMPATIBILITY ALL KIND OF TAPES
MINIMUM TAPE WIDTH 8” 215mm
12” 315mm
FOOT PRINT 1,9m2
CE marking Full compliance
SEMI Standard Full compliance
SECS-GEM Full compliance
WAFER ID / CASSETTE ID Option OCR - DOT matrix - BCR


LEONARDO 300BG DETAPER
SYSTEM SPECIFICATIONS
WAFER SIZE 8” - 12"
THROUGHPUT Process linked - average 60 wfrs/hr
CENTERING / ALIGNMENT CONTACLESS / OPTICAL SYSTEM
TAPE COMPATIBILITY ALL KIND OF TAPES
FOOT PRINT 1,9m2
CE marking Full compliance
SEMI Standard Full compliance
SECS-GEM Full compliance
WAFER ID / CASSETTE ID Option OCR - DOT matrix - BCR
UV Station Option


System appearance and specifications are subject to change
without prior notice

 
Realizzato da: EffemmedueSrl