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sabato 27 luglio 2024
Leonardo 300BG
Photopolymer Film Lamination
Leonardo 200DF
Leonardo 300DF
DIE Attach Film Lamination
Leonardo 200 LD
Metal Lift Off
Leonardo LO Series
BG & Temporary Bonding Film Lamination
Leonardo 200BG
Leonardo 300BG
UV Curing Systems
MWE 200 Plus 6"- 8"
MWE 300 8"- 12"
Wafer Handling & Inspection Systems
MWD 4 "- 6 "
Mini Environment EFEM System
Multiaxis Robots
LP100
Adept Vicron 300 Repair Center
Custom Products
Leonardo 300BG.pdf
UV Station
Leonardo 300BG
Taping Station
Detaping Station
Robot with Carbon Fiber Handler
Lowest cost of ownership through “total gap control”
software fully adjustable gap between wafers
=
lowest tape consumption
Ultra thin wafers processing: our special zero force lamination technology eliminates extra bow due to tape tension on wafers
Our unique taping roller allows to perfectly process very high bumped wafers
Ultra thin wafer detaping with our special chuck
Fully adjustable software and mechanical detaping process
LEONARDO 300BG TAPER
SYSTEM SPECIFICATIONS
WAFER SIZE
8” - 12"
THROUGHPUT
Process linked - average 50 wfrs/hr
CENTERING / ALIGNMENT
CONTACTLESS / OPTICAL SYSTEM
TAPE COMPATIBILITY
ALL KIND OF TAPES
MINIMUM TAPE WIDTH
8”
215mm
12”
315mm
FOOT PRINT
1,9m
2
CE marking
Full compliance
SEMI Standard
Full compliance
SECS-GEM
Full compliance
WAFER ID / CASSETTE ID
Option OCR - DOT matrix - BCR
LEONARDO 300BG DETAPER
SYSTEM SPECIFICATIONS
WAFER SIZE
8” - 12"
THROUGHPUT
Process linked - average 60 wfrs/hr
CENTERING / ALIGNMENT
CONTACLESS / OPTICAL SYSTEM
TAPE COMPATIBILITY
ALL KIND OF TAPES
FOOT PRINT
1,9m
2
CE marking
Full compliance
SEMI Standard
Full compliance
SECS-GEM
Full compliance
WAFER ID / CASSETTE ID
Option OCR - DOT matrix - BCR
UV Station
Option
System appearance and specifications are subject to change
without prior notice
Realizzato da: EffemmedueSrl
