sabato 27 luglio 2024
Photopolymer Film Lamination - Leonardo 300DF

Leonardo 300 - dry film lamination system

Process station

300 mm load ports

Cover sheet removal system

Photopolymer Lamination
SYSTEM SPECIFICATIONS
WAFER SIZE 8” - 12”
THROUGHPUT Process linked  average 40 wfrs/h
CENTERING / ALIGNMENT CONTACTLESS / OPTICAL SYSTEM
TAPE COMPATIBILITY ALL KIND OF PHOTOPOLYMER FILMS
MINIMUM TAPE WIDTH 8” - 215 mm
12” - 315 mm
FOOT PRINT less than 2m2
CE marking Full compliance
SEMI Standard Full compliance
SECS-GEM Full compliance
WAFER ID / CASSETTE ID Option OCR - DOT matrix - BCR

Cover Sheet Removal
SYSTEM SPECIFICATIONS
WAFER SIZE 8” - 12”
THROUGHPUT Process linked 65 wfrs/h
CENTERING / ALIGNMENT CONTACTLESS / OPTICAL SYSTEM
TAPE COMPATIBILITY 25-100mm wide
FOOT PRINT 1 m2
CE marking Full compliance
SEMI Standard Full compliance
SECS-GEM Full compliance
WAFER ID / CASSETTE ID Option OCR - DOT matrix - BCR

System appearance and specifications are subject to change without prior notice

© MICROCONTROL ELECTRONIC SRL - Via Giuba 11 - 20132 Milano - ITALY - e-mail: info@microcontrol.org - Dati Aziendali
MICROCONTROL ELECTRONIC SRL
Società unipersonale, direzione e coordinamento EMMECIGI Srl
C.F. P.IVA e R.I. Milano 08872790152
Capitale sociale € 10.400,00 i.v.
CCIAA Milano REA 1253921

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