Thursday, September 21, 2017
BG & Temporary Bonding Film Lamination
Photopolymer Film Lamination
Leonardo 200DF
Leonardo 300DF
DIE Attach Film Lamination
Leonardo 200 LD
Metal Lift Off
Leonardo LO Series
BG & Temporary Bonding Film Lamination
Leonardo 200BG
Leonardo 300BG
UV Curing Systems
MWE 200 Plus 6"- 8"
MWE 300 8"- 12"
Wafer Handling & Inspection Systems
MWD 4 "- 6 "
Mini Environment EFEM System
Multiaxis Robots
LP100
Adept Vicron 300 Repair Center
Custom Products


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© MICROCONTROL ELECTRONIC SRL - Via Giuba 11 - 20132 Milano - ITALY - e-mail: info@microcontrol.org - Dati Aziendali
MICROCONTROL ELECTRONIC SRL
Società unipersonale, direzione e coordinamento EMMECIGI Srl
C.F. P.IVA e R.I. Milano 08872790152
Capitale sociale € 10.400,00 i.v.
CCIAA Milano REA 1253921

Codice etico - Modello Generale - Quality and environment
Realizzato da: EffemmedueSrl