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giovedì 12 dicembre 2024
Photopolymer Film Lamination - Leonardo 200DF
Photopolymer Film Lamination
Leonardo 200DF
Leonardo 300DF
DIE Attach Film Lamination
Leonardo 200 LD
Metal Lift Off
Leonardo LO Series
BG & Temporary Bonding Film Lamination
Leonardo 200BG
Leonardo 300BG
UV Curing Systems
MWE 200 Plus 6"- 8"
MWE 300 8"- 12"
Wafer Handling & Inspection Systems
MWD 4 "- 6 "
Mini Environment EFEM System
Multiaxis Robots
LP100
Adept Vicron 300 Repair Center
Custom Products
Leonardo200DF.pdf
Loading station
Leonardo 200 - dry film lamination system
Process station
Cover sheet removal system
Photopolymer Lamination
SYSTEM SPECIFICATIONS
WAFER SIZE
Up to 8”
THROUGHPUT
Process linked (average of
50 wfrs/h)
CENTERING / ALIGNMENT
CONTACTLESS / OPTICAL SYSTEM
TAPE COMPATIBILITY
ALL KIND OF PHOTOPOLYMER FILMS
MINIMUM TAPE WIDTH
6” -
165 mm
8” -
215 mm
FOOT PRINT
1 m
2
CE marking
Full compliance
SEMI Standard
Full compliance
SECS-GEM
Full compliance
WAFER ID / CASSETTE ID
Option OCR - DOT matrix - BCR
Cover Sheet Removal
SYSTEM SPECIFICATIONS
WAFER SIZE
Up to 8”
THROUGHPUT
Process linked (average of 65 wfrs/h)
CENTERING / ALIGNMENT
CONTACTLESS / OPTICAL SYSTEM
TAPE COMPATIBILITY
25 mm wide ÷ 100 mm wide
FOOT PRINT
1 m
2
CE marking
Full compliance
SEMI Standard
Full compliance
SECS-GEM
Full compliance
WAFER ID / CASSETTE ID
Option OCR - DOT matrix - BCR
System appearance and specifications are subject to change without prior notice
Realizzato da: EffemmedueSrl
