Thursday, September 21, 2017
Photopolymer Film Lamination - Leonardo 200DF


Leonardo 200 - dry film lamination system

 Process station

 Cover sheet removal system



Photopolymer Lamination
SYSTEM SPECIFICATIONS
WAFER SIZE Up to 8”
THROUGHPUT Process linked (average of
50 wfrs/h)
CENTERING / ALIGNMENT CONTACTLESS / OPTICAL SYSTEM
TAPE COMPATIBILITY ALL KIND OF PHOTOPOLYMER FILMS
MINIMUM TAPE WIDTH 6” - 165 mm
8” - 215 mm
FOOT PRINT 1 m2
CE marking Full compliance
SEMI Standard Full compliance
SECS-GEM Full compliance
WAFER ID / CASSETTE ID Option OCR - DOT matrix - BCR

Cover Sheet Removal
SYSTEM SPECIFICATIONS
WAFER SIZE Up to 8”
THROUGHPUT Process linked (average of 65 wfrs/h)
CENTERING / ALIGNMENT CONTACTLESS / OPTICAL SYSTEM
TAPE COMPATIBILITY 25 mm wide ÷ 100 mm wide
FOOT PRINT 1 m2
CE marking Full compliance
SEMI Standard Full compliance
SECS-GEM Full compliance
WAFER ID / CASSETTE ID Option OCR - DOT matrix - BCR

System appearance and specifications are subject to change without prior notice
Realizzato da: EffemmedueSrl