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lunedì 9 settembre 2024
LP100
Photopolymer Film Lamination
Leonardo 200DF
Leonardo 300DF
DIE Attach Film Lamination
Leonardo 200 LD
Metal Lift Off
Leonardo LO Series
BG & Temporary Bonding Film Lamination
Leonardo 200BG
Leonardo 300BG
UV Curing Systems
MWE 200 Plus 6"- 8"
MWE 300 8"- 12"
Wafer Handling & Inspection Systems
MWD 4 "- 6 "
Mini Environment EFEM System
Multiaxis Robots
LP100
Adept Vicron 300 Repair Center
Custom Products
LP100
System appearance and specifications are subject to change without prior notice
Features
Best price & performance on the market
Cost free integration through industrial standard communication protocols
Costumized configurations
WAFER SIZE
UP TO 300 MM
OPERATING RANGE
THETA-AXIS (JOINT1) (DEG)
355
Z-AXIS (JOINT2) (MM)
400
R-AXIS (JOINT3) (MM)
180-180
REPEATABILITY
THETA-AXIS (DEG)
0.01+-
Z-AXIS (MM)
0.01+-
R-AXIS (MM)
0.01+-
RESOLUTION
THETA-AXIS (DEG)
0.0001 per encoder count
Z-AXIS (MM)
0.000007629 per encoder count
R-AXIS (MM)
0.0001 per encoder count
LOAD CAPACITY (kg)
1.5
CLEANROOM RATING
class 1
WEIGHT
Robot without options (kg)
49
WAFER MAPPING
option
END EFFECTOR
option
LINEAR AXIS
option
Realizzato da: EffemmedueSrl
