|
Features |
Developed based on our well proof lamination technology,
the Leonardo 200LD - Laminator and Mylar removal system – is the first laminator
equipment that has been qualified by a leading supplier of die attach conductive
tape material.
|
| WAFER SIZE |
Up to 8" |
| THROUGHPUT |
Process linked - Average 20 wfrs/h |
| CENTERING / ALIGNMENT |
CONTACLESS / OPTICAL SYSTEM |
|
MINIMUM TAPE WIDTH |
6” - 165 mm
8” - 215 mm
|
| DIMENSION |
D 1000 * W 2500 * H 1990> |
| CE marking |
Full compliance |
| SEMI Standard |
Full compliance |
| SECS-GEM |
Full compliance |
| WAFER ID / CASSETTE ID |
Option OCR - DOT matrix - BCR |
System appearance and specifications are subject to change
without prior notice
|