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Thursday, September 21, 2017
DIE Attach Film Lamination - Leonardo 200 LD
Photopolymer Film Lamination
Leonardo 200DF
Leonardo 300DF
DIE Attach Film Lamination
Leonardo 200 LD
Metal Lift Off
Leonardo LO Series
BG & Temporary Bonding Film Lamination
Leonardo 200BG
Leonardo 300BG
UV Curing Systems
MWE 200 Plus 6"- 8"
MWE 300 8"- 12"
Wafer Handling & Inspection Systems
MWD 4 "- 6 "
Mini Environment EFEM System
Multiaxis Robots
LP100
Adept Vicron 300 Repair Center
Custom Products
Leonardo 200 LD
Leonardo 200 LD.pdf
Leonardo 200 LD Process.pdf
Features
Developed based on our well proof lamination technology, the Leonardo 200LD - Laminator and Mylar removal system – is the first laminator equipment that has been qualified by a leading supplier of die attach conductive tape material.
WAFER SIZE
Up to 8"
THROUGHPUT
Process linked - Average 20 wfrs/h
CENTERING / ALIGNMENT
CONTACLESS / OPTICAL SYSTEM
MINIMUM TAPE WIDTH
6” -
165 mm
8” -
215 mm
DIMENSION
D 1000 * W 2500 * H 1990>
CE marking
Full compliance
SEMI Standard
Full compliance
SECS-GEM
Full compliance
WAFER ID / CASSETTE ID
Option OCR - DOT matrix - BCR
System appearance and specifications are subject to change without prior notice
Realizzato da: EffemmedueSrl
