Thursday, September 21, 2017
DIE Attach Film Lamination - Leonardo 200 LD

Features
Developed based on our well proof lamination technology, the Leonardo 200LD - Laminator and Mylar removal system – is the first laminator equipment that has been qualified by a leading supplier of die attach conductive tape material.

WAFER SIZE Up to 8"
THROUGHPUT Process linked - Average 20 wfrs/h
CENTERING / ALIGNMENT CONTACLESS / OPTICAL SYSTEM
MINIMUM TAPE WIDTH 6” - 165 mm
8” - 215 mm
DIMENSION D 1000 * W 2500 * H 1990>
CE marking Full compliance
SEMI Standard Full compliance
SECS-GEM Full compliance
WAFER ID / CASSETTE ID Option OCR - DOT matrix - BCR


System appearance and specifications are subject to change without prior notice



Realizzato da: EffemmedueSrl