Leonardo DR Series
Designed and manufactured in the early 2000s at the request of one of the leading semiconductor manufacturers. The photolithographic film is particularly used for patterning large topographies in the production of MEMS or during RDL, TSV, and 3D processes.
Leonardo Series DR – Lamination System, handles every kind of films on the market being able to control tension, speed, temperature and pressure of film deposition.
When polymer is completely laminated the heated cutter trims the two layers in contact with the edge of the wafer without defects.
FEATURES
- Leonardo 200 DR Available from 100 to 200 mm (for 8” – 6” – 5” – 4”)
- Leonardo 300 DR Available for 200 &/or 300 mm (12” – 8″)
- Compatible with every tape available on the market
- Heated chuck table and lamination roll
- Dynamic lamination pressure control
- Automatic Mylar removal
- 200 mm SMIF cassette opener (option)
- 300 mm load port (option)
- E84 full compliance
- SECS/GEM host communication full compliance
- Contact less lamination and Mylar removal (option)
- Edge contact wafer handling (option)
- Wafer flipping unit (option)
- Buffer station (option)
- Wafer ID reader (top/bottom – option)
- Tape ID reader (option)
- ESD control
- CE marking
- Semi S2/S8 compliance
Leonardo Series LD
The most flexible fully automatic machine of the MCE portfolio, it combines a Lamination and a Delamination process in a single tool, suggested when the polyester (Mylar) layer needs to be immediately removed after the film deposition.
FEATURES
- Leonardo 200 LD Available from 100 to 200 mm (for 8” – 6” – 5” – 4”)
- Leonardo 300 LD Available for 200 &/or 300 mm (12” – 8″)
- Compatible with every tape available on the market
- Heated chuck table and lamination roll
- Dynamic lamination pressure control
- Automatic Mylar removal
- 200 mm SMIF cassette opener (option)
- 300 mm load port (option)
- E84 full compliance
- SECS/GEM host communication full compliance
- Contact less lamination and Mylar removal (option)
- Edge contact wafer handling (option)
- Wafer flipping unit (option)
- Buffer station (option)
- Wafer ID reader (top/bottom – option)
- Tape ID reader (option)
- ESD control
- CE marking
- Semi S2/S8 compliance