Leonardo 200BG Series
State of art, fully automatic tape Lamination and Delamination systems for different processes (such as Back Grinding and Temporary Bonding) and semiconductor materials, including GaAs and GaN.
The Leonardo laminator, applies a tape to the active side of the wafer prior to the back grinding process, or to protect a side of the wafer (either front or back) to allow subsequent processes ( wet, probing…).
LAMINATION SYSTEM FEATURES
- Leonardo 200BG Available from 100 to 200 mm (for 8” – 6” – 5” – 4”)
- Leonardo 300BG Available for 200 &/or 300 mm (12” – 8″)
- Compatible with every tape available on the market
- Heated chuck table and lamination roll (option)
- Dynamic lamination pressure control
- 200 mm SMIF cassette opener (option)
- 300 mm load port (option)
- E84 full compliance
- SECS/GEM host communication full compliance
- Contact less lamination (option)
- Edge contact wafer handling (option)
- Wafer flipping unit (option)
- Buffer station (option)
- Wafer ID reader (top/bottom – option)
- ESD control
- CE marking
- Semi S2/S8 compliance
With the fully automatic delaminator tool, the tape previously applied can be safely removed from the wafer, after being cured (if necessary) by means of an LED UV lamp.
DELAMINATOIN SYSTEM FEATURES
- Leonardo 200BG Available from 100 to 200 mm (for 8” – 6” – 5” – 4”)
- Leonardo 300BG Available for 200 &/or 300 mm (12” – 8″)
- LED UV curing station (option)
- TAIKO® Wafer Delamination (option)
- 200 mm SMIF cassette opener (option)
- 300 mm load port (option)
- E84 full compliance
- SECS/GEM host communication full compliance
- High warpage wafer handling
- Contact less delamination (option)
- Edge contact wafer handling (option)
- Wafer flipping unit (option)
- Buffer station (option)
- Wafer ID reader (top/bottom – option)
- ESD control
- CE marking
- Semi S2/S8 compliance