Leonardo DLO Series
Fully automatic Dry Metal Lift Off system to remove unnecessary metal layer using an adhesive tape which is laminate and immediately removed from the wafer surface also making precious metal recycling easier.
This easier and more environmental friendly method removes in only one process step metal sandwiches (such as Ti-Au-Ti or Au-Ti etc) to allow switching to a solvent free process.
FEATURES
- Leonardo 200DLO Available from 100 to 200 mm (for 8” – 6” – 5” – 4”)
- Leonardo 300 DLO Available for 200 &/or 300 mm
- 200 mm SMIF cassette opener (option)
- 300 mm load port (option)
- E84 full compliance
- SECS/GEM host communication full compliance
- Wafer ID reader (top/bottom – option)
- ESD control
- CE marking
- Semi S2/S8 compliance