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MWE 300
 Photopolymer Film Lamination
 DIE Attach Film Lamination
 Metal Lift Off
 BG & Temporary Bonding
 Film Lamination
 UV Curing Systems
MWE 200 Plus 6"- 8"
MWE 300 8"- 12"
 Wafer Handling
 & Inspection Systems
 Multiaxis Robots
 Custom Products
   
MWE 300
Features

Fully automated system to erase memories and EPROM’s on wafer

Fully servo controlled robot and arm lift

Highly flexible control system allows to change wafer size up to 12 ” with no hardware operations

Menu based operator interface with wafer program storage

High efficiency UV lamp with level measuring system and exposure time compensation

Easily accessible for fast maintenance

CE safety features

Smallestfootprint

Signal tower for status identification

Easy to use touch screen display

All machine functions are directly accessible

Operator identification with different password levels

Process parameters on production display

Optional printer kit with process and log report

Control Panel

Handling System

Robot arm handling

Servo controlled step motor movements for arm and lift

No wafer prealignment required

Arm surface with special treatmen

Operation Modes

Automatic and process

In automatic mode a recalled program is continuously executed to process wafer cassette

In process mode the process can be tuned to define the best exposure time and handling parameters for each wafer type

Diagnostic system with clear error messages

Service function to allow easy calibration and setup

UV lamp
SPECIFICATIONS
POWER AC 110/220 V - 50/60 Hz - 1300 VA
VACUUM 100 Torr
WEIGHT 120 Kg
SIZE 1160 mm (L) - 700 mm (W) - 830 mm (H)

System appearance and specifications are subject to change
without prior notice

MICROCONTROL ELECTRONIC SRL- VIA GIUBA 11 - 20132 MILANO - CF e PI 08872790152 - Cap.sociale Euro 10.400,00 i.v.