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MWE 300 Micol Wafer Eraser
 Photopolymer Film Lamination
 Taping and Detaping
 Wafer and Handling Systems
MWE 200 Plus 6"- 8"
MWE 300 8"- 12"
MWD 4 "- 6 "
 Custom Products
   
MWE 300 Plus
Features

Fully automated system to erase memories and EPROM’s on wafer

Fully servo controlled robot and arm lift

Highly flexible control system allows to change wafer size up to 12 ” with no hardware operations

Menu based operator interface with wafer program storage

Class 10 compatible (1 on request)

Mirror finished stainless steel body

High efficiency UV lamp with level measuring system and exposure time compensation

Easily accessible for fast maintenance

Handling throughput: 300 wfrs/h

CE safety features

Smallestfootprint

Signal tower for status identification

All function are directly accessible on very easy-to-use operator terminal with LCD display and keyboard

All machine functions are directly accessible

Operator identification with different password levels

Process parameters on production display

Optional printer kit with process and log report

Control Panel

Handling System

Robot arm handling

Servo controlled step motor movements for arm and lift

No wafer prealignment required

Arm surface with special treatmen

Operation Modes

Automatic and process

In automatic mode a recalled program is continuously executed to process wafer cassette

In process mode the process can be tuned to define the best exposure time and handling parameters for each wafer type

Diagnostic system with clear error messages

Service function to allow easy calibration and setup

Language selection on request
UV lamp
SPECIFICATIONS
POWER AC 110/220 V - 50/60 Hz - 1300 VA
VACUM 100 Torr
WEIGHT 120 Kg
SIZE 1160 mm (L) - 700 mm (W) - 830 mm (H)
EXHAUST Needed for class 1 environment