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MMI 200
 Photopolymer Film Lamination
 DIE Attach Film Lamination
 Metal Lift Off
 BG & Temporary Bonding
 Film Lamination
 UV Curing Systems
 Wafer Handling &
 Inspection Systems 
MMI 200
MWD 4 "- 6 "
Mini Environment EFEM System
 Multiaxis Robots
 Custom Products

   
MMI 200 
Features

Two axis front side macro inspection

Automatic  and manual (joystick) routine for wafer tilting

Fully automatic system for  up to 8? wafers without any mechanical setting

Flat alignment not
required

Wafer mapping

Easy to use touch screen  operator interface

Smallest footprint

2 Indexers
(sender/receiver/reject programmable)

Beltless transportation, low particle generation through minimal handling

MMI 200 

MMI 200 
SPECIFICATIONS
POWER AC 110/220 V - 50 Hz - 150 VA
VACUUM 100 Torr
WEIGHT 70 Kg
SIZE 1000 mm (L) - 600 mm (W) - 500 mm (H)
WAFER SIZE

Up to 8? WAFER WITHOUT ANY SETTING

CHUCK Vacuum assisted - rotating 360° and tilting
SECS GEM Full compliance
WAFER CARRIER 25 slots std 3/16" pitch cassette
CE marking Full compliance
  

  
MMI 200 

MICROCONTROL ELECTRONIC SRL- VIA GIUBA 11 - 20132 MILANO - CF e PI 08872790152 - Cap.sociale Euro 10.400,00 i.v.