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Leonardo 300 Photopolymer Film Lamination
 Photopolymer Film Lamination
Leonardo 200
Leonardo 300
 DIE Attach Film Lamination
 Metal Lift Off
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Leonardo 300
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Leonardo 300

Process station

300 mm load ports


Photopolymer Lamination
SYSTEM SPECIFICATIONS
WAFER SIZE 8” - 12”
THROUGHPUT Process linked  50 wfrs/h
CENTERING / ALIGNMENT CONTACLESS VISION SYSTEM
TAPE COMPATIBILITY ALL KIND OF PHOTOPOLYMER FILMS
MINIMUM TAPE WIDTH 8” - 215 mm
12” - 315 mm
N° of 12 ” WAFERS WITH 100m ROLL up to 320 wfrs
FOOT PRINT less than 2m2
CE marking Full compliance
SEMI Standard Full compliance
SECS-GEM full compliance Option
WAFER ID / CASSETTE ID Option OCR - DOT matrix - BCR
   

System appearance and specifications are subject to change
without prior notice
Cover sheet removal system
Cover Sheet Removal
SYSTEM SPECIFICATIONS
WAFER SIZE 8” - 12”
THROUGHPUT Process linked 65 wfrs/h
TRANSPORT CONTACLESS VISION SYSTEM
TAPE COMPATIBILITY 25-100mm wide
FOOT PRINT 1 m2
CE marking Full compliance
SEMI Standard Full compliance
SECS-GEM full compliance Option
WAFER ID / CASSETTE ID Option OCR - DOT matrix - BCR
   

System appearance and specifications are subject to change
without prior notice

MICROCONTROL ELECTRONIC SRL- VIA GIUBA 11 - 20132 MILANO - CF e PI 08872790152 - Cap.sociale Euro 10.400,00 i.v.