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Leonardo 300 Photopolymer Film Lamination
 Photopolymer Film Lamination
Leonardo 200
Leonardo 300
 Taping and Detaping
 Wafer and Handling Systems
 Custom Products

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Leonardo 300
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Leonardo 300

Process station

300 mm load ports


Photopolymer Lamination
SYSTEM SPECIFICATIONS
WAFER SIZE 8” - 12”
THROUGHPUT PROCESS DEPENDING (average of 50 wfrs/h)
CENTERING / ALIGNMENT CONTACLESS VISION SYSTEM
TAPE COMPATIBILITY ALL KIND OF TAPES
MINIMUM TAPE WIDTH 8” - 215 mm
12” - 315 mm
N° of 12 ” WAFERS WITH 100m ROLL 12” 320 wfrs
FOOT PRINT 1 m2
CE marking Full compliance
SEMI Standard Full compliance
SECS-GEM full compliance Option
WAFER ID / CASSETTE ID Option OCR - DOT matrix - BCR
SMIF SYSTEM Option
M.T.B.F. 550 hrs
M.T.T.R. 1hr
   
Cover sheet removal system
Cover Sheet Removal
SYSTEM SPECIFICATIONS
WAFER SIZE 8” - 12”
THROUGHPUT 65 wfrs/h
TRANSPORT CONTACLESS VISION SYSTEM
TAPE COMPATIBILITY ALL KIND OF TAPES
FOOT PRINT 1 m2
CE marking Full compliance
SEMI Standard Full compliance
SECS-GEM full compliance Option
WAFER ID / CASSETTE ID Option OCR - DOT matrix - BCR
SMIF SYSTEM Option
M.T.B.F. 550 hrs
M.T.T.R. 1hr