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			Leonardo 200 Photopolymer Film Lamination
Photopolymer Film Lamination Leonardo 200 Leonardo 300  DIE Attach Film Lamination  Metal Lift Off  BG & Temporary Bonding  Film Lamination  UV Curing Systems  Wafer Handling  & Inspection Systems  Multiaxis Robots  Custom Products   Download Brochure Leonardo 200 Adobe® Acrobat® document - 272 Kb		Leonardo 200 Process station Loading station Photopolymer Lamination SYSTEM SPECIFICATIONS WAFER SIZE Up to 8” THROUGHPUT Process linked 60 wfrs/h CENTERING / ALIGNMENT CONTACLESS VISION SYSTEM TAPE COMPATIBILITY ALL KIND OF PHOTOPOLYMER FILMS MINIMUM TAPE WIDTH 6” - 165 mm 8” - 215 mm N° of 8” WAFERS WITH 100m ROLL Up to 470 wfrs FOOT PRINT 1 m2 CE marking Full compliance SEMI Standard Full compliance SECS-GEM full compliance Option WAFER ID / CASSETTE ID Option OCR - DOT matrix - BCR     System appearance and specifications are subject to change without prior notice Cover sheet removal system Cover Sheet Removal SYSTEM SPECIFICATIONS WAFER SIZE Up to 8” THROUGHPUT Process linked 90 wfrs/h TRANSPORT ROBOT ARM TAPE COMPATIBILITY 25 mm wide ÷ 100 mm wide FOOT PRINT 1 m2 CE marking Full compliance SEMI Standard Full compliance SECS-GEM full compliance Option WAFER ID / CASSETTE ID Option OCR - DOT matrix - BCR

MICROCONTROL ELECTRONIC SRL- VIA GIUBA 11 - 20132 MILANO - CF e PI 08872790152 - Cap.sociale Euro 10.400,00 i.v.