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Leonardo 200 Photopolymer Film Lamination
 Photopolymer Film Lamination
Leonardo 200
Leonardo 300
 Taping and Detaping
 Wafer and Handling Systems
 Custom Products

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Leonardo 200
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Leonardo 200

Process station

Loading station


Photopolymer Lamination
SYSTEM SPECIFICATIONS
WAFER SIZE Up to 8”
THROUGHPUT Process linked (average of
60 wfrs/h)
CENTERING / ALIGNMENT CONTACLESS VISION SYSTEM
TAPE COMPATIBILITY ALL KIND OF PHOTOPOLYMER FILMS
MINIMUM TAPE WIDTH 6” - 165 mm
8” - 215 mm
N° of 8” WAFERS WITH 100m ROLL Up to 470 wfrs
FOOT PRINT 1 m2
CE marking Full compliance
SEMI Standard Full compliance
SECS-GEM full compliance Option
WAFER ID / CASSETTE ID Option OCR - DOT matrix - BCR
SMIF SYSTEM Option
M.T.B.F. 550 hrs
M.T.T.R. 1hr
   
Cover sheet removal system
Cover Sheet Removal
SYSTEM SPECIFICATIONS
WAFER SIZE Up to 8”
THROUGHPUT 90 wfrs/h
TRANSPORT ROBOT ARM
TAPE COMPATIBILITY 25 mm wide ÷ 100 mm wide
FOOT PRINT 1 m2
CE marking Full compliance
SEMI Standard Full compliance
SECS-GEM full compliance Option
WAFER ID / CASSETTE ID Option OCR - DOT matrix - BCR
SMIF SYSTEM Option
M.T.B.F. 550 hrs
M.T.T.R. 1hr
   

MICROCONTROL ELECTRONIC SRL- VIA GIUBA 11 - 20132 MILANO - CF e PI 08872790152 - Cap.sociale Euro 10.400,00 i.v.