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812 Series Taper and Detaper
 Photopolymer Film Lamination
 DIE Attach Film Lamination
 Metal Lift Off
 BG & Temporary Bonding
 Film Lamination
456 Series
408 II Series
812 Series
 UV Curing Systems
 Wafer Handling
 & Inspection Systems
 Multiaxis Robots
 Custom Products

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812 series
Adobe® Acrobat® document - 775 Kb
812 Series 8"- 12" Taper/Detaper

Lowest cost of ownership through “ total gap control”
software fully adjustable gap between wafers
=
lowest tape consumption

Ultra thin wafers processing:
our special zero force lamination
technology eliminates extra bow
due to tape tension on wafers

Our unique taping roller allows to perfectly
process very high bumped wafers
Ultra thin wafer detaping
with our special chuck

Fully adjustable software and
mechanical detaping process
Taping Station
812 Series TAPER
SYSTEM SPECIFICATIONS
WAFER SIZE 8” - 12"
THROUGHPUT Process linked 90 wfrs/hr
CENTERING / ALIGNMENT CONTACLESS VISION SYSTEM
TAPE COMPATIBILITY ALL KIND OF TAPES
MINIMUM TAPE WIDTH 8” 215mm
12” 315mm
N° of 8” WAFERS WITH 100m ROLL 8" 470 Wfrs - 12" 320 Wfrs
FOOT PRINT 1,9m2
CE marking Full compliance
SEMI Standard Full compliance
SECS-GEM full compliance Option
WAFER ID / CASSETTE ID Option OCR - DOT matrix - BCR
   

System appearance and specifications are subject to change
without prior notice
Detaping Station
812 Series DETAPER
SYSTEM SPECIFICATIONS
WAFER SIZE 8” - 12"
THROUGHPUT Process linked 100 wfrs/hr
CENTERING / ALIGNMENT CONTACLESS VISION SYSTEM
TAPE COMPATIBILITY ALL KIND OF TAPES
FOOT PRINT 1,9m2
CE marking Full compliance
SEMI Standard Full compliance
SECS-GEM full compliance Option
WAFER ID / CASSETTE ID Option OCR - DOT matrix - BCR
UV Station Option
   

System appearance and specifications are subject to change
without prior notice
300 mm Load Ports

Robot with Carbon Fiber Handler

UV Station

MICROCONTROL ELECTRONIC SRL- VIA GIUBA 11 - 20132 MILANO - CF e PI 08872790152 - Cap.sociale Euro 10.400,00 i.v.