 Fully
automatic tape peeling process computer controlled
Guaranteed
performances:
- Highest throughput
- No wafer breakage
- Highest up-time
- Very low maintenance requirements
Higher
productivity at lower cost avoiding manual or chemical
removal methods
|
Able
to handle wafer thinner than 200 micron
Care
handle of the lapped surfaces to avoid scratches that
could create problems in evaporation process
Simplest
machine/operator approach
|
Strong
mechanic and reliable electonic coupled with a state of
art software
Mirror
finished stainless-steel cover
Compact
design saving floor space
4-5-6" wafer
|
